IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch Bumping

Aoki, Toyohiro, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii, Jae-Woong Nah, Seiichirou Takahashi, Jun Mukawa, Kouichi Hasegawa, Shiro Kusumoto, and Katsumi Inomata. 2014. “IMS (Injection Molded Solder) Technology with Liquid Photoresist for Ultra Fine Pitch Bumping.” IMAPSource Proceedings 2014 (1): 713–17. https:/​/​doi.org/​10.4071/​isom-WP42.