Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)
Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)
Rasmussen, David J, and Rodney Thompson. 2010. “Improved Bond Reliability through the Use of Auxiliary Wires (Security Bumps and Stand-Off Stitch).” IMAPSource Proceedings 2010 (1): 474–78. https://doi.org/10.4071/isom-2010-WA4-Paper3.