Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Compressive-Post Packaging of Double-Sided Die
Compressive-Post Packaging of Double-Sided Die
Woochan Kim, Jia-Woei Wu, Bill Alexander, Sauvik Chowdhury, Collin Hitchcock, Nga C. Lee, James J. Q. Lu, T. Paul Chow, Khai D. T. Ngo,
Kim, Woochan, Jia-Woei Wu, Bill Alexander, Sauvik Chowdhury, Collin Hitchcock, Nga C. Lee, James J. Q. Lu, T. Paul Chow, and Khai D. T. Ngo. 2014. “Compressive-Post Packaging of Double-Sided Die.” IMAPSource Proceedings 2014 (1): 31–36. https://doi.org/10.4071/isom-TA21.