Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests

Gordon Elger; Shri Vishnu Kandaswamy; Robert Derix; Jürgen Wilde

doi:10.4071/isom-2013-THP47

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Elger, Gordon, Shri Vishnu Kandaswamy, Robert Derix, and Jürgen Wilde. 2013. “Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests.” IMAPSource Proceedings 2013 (1): 902–7. https://doi.org/10.4071/isom-2013-THP47.

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