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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Cost Analysis of TSV Process and Scaling Options

Victor Vartanian, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp, Tyler Barbera, Steve Golovato, Kai-Hung Yu, Toshio Hasegawa, Shan Hu, Gert Leusink, Kaoru Maekawa, Jack Enloe, Alison Gracias, Gyanaranjan Pattanaik, Fred Wafula,
Cost model cost of ownership through-silicon via 3D electrochemical deposition barrier-seed ruthenium CMP wet cleans
• https://doi.org/10.4071/isom-TA11
IMAPSource Conference Papers
Vartanian, Victor, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp, Tyler Barbera, Steve Golovato, et al. 2014. “Cost Analysis of TSV Process and Scaling Options.” IMAPSource Proceedings 2014 (1): 1–7. https://doi.org/10.4071/isom-TA11.
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