Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Cost Analysis of TSV Process and Scaling Options
Victor Vartanian
,
Larry Smith
,
Klaus Hummler
,
Steve Olson
,
Brian Sapp
,
Tyler Barbera
,
Steve Golovato
,
Kai-Hung Yu
,
Toshio Hasegawa
,
Shan Hu
,
Gert Leusink
,
Kaoru Maekawa
,
Jack Enloe
,
Alison Gracias
,
Gyanaranjan Pattanaik
,
Fred Wafula
,
Cost model
cost of ownership
through-silicon via
3D
electrochemical deposition
barrier-seed
ruthenium
CMP
wet cleans
•
https://doi.org/10.4071/isom-TA11
IMAPSource Conference Papers
Vartanian, Victor, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp, Tyler Barbera, Steve Golovato, et al. 2014. “Cost Analysis of TSV Process and Scaling Options.”
IMAPSource Proceedings
2014 (1): 1–7.
https://doi.org/10.4071/isom-TA11
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats