New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman Thermography

Faqir, M., A. Manoi, T. Mrotzek, S. Knippscheer, M. Massiot, M. Buchta, H. Blanck, S. Rochette, O. Vendier, and M. Kuball. 2010. “New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography.” IMAPSource Proceedings 2010 (1): 446–49. https://doi.org/10.4071/isom-2010-WA3-Paper3.