Vol. 2012, Issue 1, 2012January 01, 2012 EDT
High Yield Embedding of 30μm Thin Chips in a Flexible PCB using a Photopatternable Polyimide based Ultra-Thin Chip Package (UTCP)
High Yield Embedding of 30μm Thin Chips in a Flexible PCB using a Photopatternable Polyimide based Ultra-Thin Chip Package (UTCP)
Sterken, T., M. Op de Beeck, F. Vermeiren, T. Torfs, L. Wang, S. Priyabadini, K. Dhaenens, D. Cuypers, and J. Vanfleteren. 2012. “High Yield Embedding of 30μm Thin Chips in a Flexible PCB Using a Photopatternable Polyimide Based Ultra-Thin Chip Package (UTCP).” IMAPSource Proceedings 2012 (1): 940–45. https://doi.org/10.4071/isom-2012-WP52.