Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application
Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application
Tran, Tu Anh, Varughese Mathew, and Harold Downey. 2011. “Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application.” IMAPSource Proceedings 2011 (1): 589–99. https://doi.org/10.4071/isom-2011-WA4-Paper4.
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