Development of Printed Power Packaging for a High Voltage SiC Module

Haotao KE; Douglas C Hopkins

doi:10.4071/isom-2012-WP55

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KE, Haotao, and Douglas C Hopkins. 2012. “Development of Printed Power Packaging for a High Voltage SiC Module.” IMAPSource Proceedings 2012 (1): 955–60. https://doi.org/10.4071/isom-2012-WP55.

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