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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Flip-Chip Flux Evolution
Andy Mackie
,
Hyoryoon Jo
,
Sze Pei Lim
,
Flip-chip
Cu-pillar
flux
thermocompression bonding (TCB)
laser assisted bonding (LAB)
heterogeneous integration
SiP
•
https://doi.org/10.4071/2380-4505-2019.1.000115
IMAPSource Conference Papers
Mackie, Andy, Hyoryoon Jo, and Sze Pei Lim. 2019. “Flip-Chip Flux Evolution.”
IMAPSource Proceedings
2019 (1): 115–19.
https://doi.org/10.4071/2380-4505-2019.1.000115
.
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