Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Design and Process Considerations in Transitioning From Aluminum Wire to Aluminum Ribbon
C. Italiano
,
Y. Mindin M. Oud
,
bonding
power devices
aluminum ribbon
heat dissipation
power bond ribbon
high purity
aluminum bonding aluminum wire
•
https://doi.org/10.4071/isom-2016-THA33
IMAPSource Conference Papers
Italiano, C., and Y. Mindin M. Oud. 2016. “Design and Process Considerations in Transitioning From Aluminum Wire to Aluminum Ribbon.”
IMAPSource Proceedings
2016 (1): 438–44.
https://doi.org/10.4071/isom-2016-THA33
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats