Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)
Heng-Chieh Chien, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, Ming-Jer Kao,
Chien, Heng-Chieh, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, and Ming-Jer Kao. 2011. “Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).” IMAPSource Proceedings 2011 (1): 25–32. https://doi.org/10.4071/isom-2011-TA1-Paper4.
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