Chien, Heng-Chieh, John H. Lau, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Sheng-Tsai Wu, Wei-Chung Lo, and Ming-Jer Kao. 2011. “Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).”
IMAPSource Proceedings 2011 (1): 25–32.
https://doi.org/10.4071/isom-2011-TA1-Paper4.