Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
Fowler, Michelle, John P. Massey, Matthew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt, and Markus Wohrmann. 2018. “Advances in Temporary Bonding and Debonding Technologies for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes.” IMAPSource Proceedings 2018 (1): 51–56. https://doi.org/10.4071/2380-4505-2018.1.000051.
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