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Symposium Proceedings
Vol. 2017, Issue S1, 2017
October 01, 2017 EDT
Packaging Challenges for the Next Generation of Mobile Devices
Ahmer Syed
,
Packaging Challenges
Next Generation
Mobile Devices
IC Design
Designing IC Packages
•
https://doi.org/10.4071/isom-2017-slide-1
IMAPSource Conference Papers
Syed, Ahmer. 2017. “Packaging Challenges for the Next Generation of Mobile Devices.”
IMAPSource Proceedings
2017 (S1): 1–23.
https://doi.org/10.4071/isom-2017-slide-1
.
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