Vol. 2012, Issue 1, 2012January 01, 2012 EDT
DESIGN AND PROCESS OPTIMIZATION OF THROUGH SILICON VIA INTERPOSER FOR 3D-IC INTEGRATION
DESIGN AND PROCESS OPTIMIZATION OF THROUGH SILICON VIA INTERPOSER FOR 3D-IC INTEGRATION
Monajemi, Pejman, Michael Newman, Cyprian Uzoh, Charles Woychik, and Terrence Caskey. 2012. “DESIGN AND PROCESS OPTIMIZATION OF THROUGH SILICON VIA INTERPOSER FOR 3D-IC INTEGRATION.” IMAPSource Proceedings 2012 (1): 268–75. https://doi.org/10.4071/isom-2012-TP16.
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