Novel formaldehyde-free electroless copper for plating on next-generation substrates

Christian Wendeln; Edith Steinhäuser; Lutz Stamp; Bexy Dosse-Gomez; Elisa Langhammer; Sebastian Reiber; Sebastian Dünnebeil; Sandra Röseler

doi:10.4071/2380-4505-2018.1.000628

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Wendeln, Christian, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, and Sandra Röseler. 2018. “Novel Formaldehyde-Free Electroless Copper for Plating on next-Generation Substrates.” IMAPSource Proceedings 2018 (1): 628–33. https://doi.org/10.4071/2380-4505-2018.1.000628.

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