Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Understanding and Controlling Cu Protrusions in 3D TSV Processing
Understanding and Controlling Cu Protrusions in 3D TSV Processing
Kruger, Seth, Klaus Hummler, Robert Geer, Kathleen Dunn, Colin McDonough, Aaron Cordes, Jack Enloe, et al. 2012. “Understanding and Controlling Cu Protrusions in 3D TSV Processing.” IMAPSource Proceedings 2012 (1): 23–30. https://doi.org/10.4071/isom-2012-TA15.