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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Heat Sink Induced Thermo-Mechanical Joint Strain in QFN Devices
Gerard McVicker
,
Vijay Khanna
,
Sri M. Sri-Jayantha
,
Heat sink mount
solder strain
lead-free solder
FEM modeling
thermal cycling
•
https://doi.org/10.4071/isom-2013-WA22
IMAPSource Conference Papers
McVicker, Gerard, Vijay Khanna, and Sri M. Sri-Jayantha. 2013. “Heat Sink Induced Thermo-Mechanical Joint Strain in QFN Devices.”
IMAPSource Proceedings
2013 (1): 467–72.
https://doi.org/10.4071/isom-2013-WA22
.
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