Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate
Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate
Chou, Bruce, Brett Sawyer, William Vis, Ryuta Furuya, Fuhan Liu, Venky Sundaram, and Rao Tummala. 2016. “Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate.” IMAPSource Proceedings 2016 (1): 7–12. https://doi.org/10.4071/isom-2016-TP12.
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