Vol. 2013, Issue 1, 2013January 01, 2013 EDT
RF Device Integration on Glass Interposer toward 3D-IPAC Packages
RF Device Integration on Glass Interposer toward 3D-IPAC Packages
Sato, Yoichiro, Bruce Chou, Vijay Sukumaran, Junki Min, Motoshi Ono, Choukri Karoui, Franck Dosseul, et al. 2013. “RF Device Integration on Glass Interposer toward 3D-IPAC Packages.” IMAPSource Proceedings 2013 (1): 825–30. https://doi.org/10.4071/isom-2013-THP22.
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