Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements
Kuechenmeister, Frank, Dirk Breuer, Holm Geisler, Bjoern Boehme, Kashi Vishwanath Machani, Michael Hecker, Sven Kosgalwies, et al. 2018. “Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements.” IMAPSource Proceedings 2018 (1): 173–79. https://doi.org/10.4071/2380-4505-2018.1.000173.