Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications
Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications
Hung, Jui-Feng, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Sheng-Che Hung, Shinn-Juh Lai, Ming-Lin Li, et al. 2012. “Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications.” IMAPSource Proceedings 2012 (1): 1221–28. https://doi.org/10.4071/isom-2012-THP63.
Powered by Scholastica, the modern academic journal management system