Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package
Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package
Yamada, Tomoyuki, Masahiro Fukui, Kenji Terada, Masaaki Harazono, Teruya Fujisaki, Sushumna Iruvanti, Charles Carey, et al. 2014. “Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package.” IMAPSource Proceedings 2014 (1): 68–73. https://doi.org/10.4071/isom-TA31.
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