Yamada, Tomoyuki, Masahiro Fukui, Kenji Terada, Masaaki Harazono, Teruya Fujisaki, Sushumna Iruvanti, Charles Carey, et al. 2014. “Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package.”
IMAPSource Proceedings 2014 (1): 68–73.
https://doi.org/10.4071/isom-TA31.