Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Isothermal Aging Effects on the Thermal reliability Performance of Lead-Free Solder Joints
Isothermal Aging Effects on the Thermal reliability Performance of Lead-Free Solder Joints
PBGA Plastic Ball Grid ArrayENIG Electroless Nickel Immersion GoldSMT Surface Mount TechnologyJEDEC Joint Electron Device Engineering CouncilPCB Printed Circuit BoardRoHS Restriction of Hazardous SubstancesSEM Scanning Electron MicroscopyNSMD Non solder mask definedWEEE Waste from Electrical and Electronic EquipmentCTE Coefficient of Thermal ExpansionAg SilverCu CopperIm ImmersionPb LeadSn Tinβ Slopeη Characteristic Lifeρ Probability plotTg Glass Transition Temperature
Zhang, Jiawei, Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, and M. J. Bozack. 2012. “Isothermal Aging Effects on the Thermal Reliability Performance of Lead-Free Solder Joints.” IMAPSource Proceedings 2012 (1): 801–8. https://doi.org/10.4071/isom-2012-WP21.