Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Isothermal Aging Effects on the Thermal reliability Performance of Lead-Free Solder Joints
Isothermal Aging Effects on the Thermal reliability Performance of Lead-Free Solder Joints
PBGA Plastic Ball Grid Array ENIG Electroless Nickel Immersion Gold SMT Surface Mount Technology JEDEC Joint Electron Device Engineering Council PCB Printed Circuit Board RoHS Restriction of Hazardous Substances SEM Scanning Electron Microscopy NSMD Non solder mask defined WEEE Waste from Electrical and Electronic Equipment CTE Coefficient of Thermal Expansion Ag Silver Cu Copper Im Immersion Pb Lead Sn Tin β Slope η Characteristic Life ρ Probability plot Tg Glass Transition Temperature
Zhang, Jiawei, Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, and M. J. Bozack. 2012. “Isothermal Aging Effects on the Thermal Reliability Performance of Lead-Free Solder Joints.” IMAPSource Proceedings 2012 (1): 801–8. https://doi.org/10.4071/isom-2012-WP21.