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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Reliability of silver wedge bonding for power devices

Xing Wei, Zhou Yu, Wanmeng Xu, Tomonori Iizuka, Kohei Tatsumi,
Wedge Bonding Silver Wire Intermetallic Compounds Power Devices
• https://doi.org/10.4071/isom-Poster4
IMAPSource Conference Papers
Wei, Xing, Zhou Yu, Wanmeng Xu, Tomonori Iizuka, and Kohei Tatsumi. 2015. “Reliability of Silver Wedge Bonding for Power Devices.” IMAPSource Proceedings 2015 (1): 735–39. https://doi.org/10.4071/isom-Poster4.
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