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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Reliability of silver wedge bonding for power devices
Xing Wei
,
Zhou Yu
,
Wanmeng Xu
,
Tomonori Iizuka
,
Kohei Tatsumi
,
Wedge Bonding
Silver Wire
Intermetallic Compounds
Power Devices
•
https://doi.org/10.4071/isom-Poster4
IMAPSource Conference Papers
Wei, Xing, Zhou Yu, Wanmeng Xu, Tomonori Iizuka, and Kohei Tatsumi. 2015. “Reliability of Silver Wedge Bonding for Power Devices.”
IMAPSource Proceedings
2015 (1): 735–39.
https://doi.org/10.4071/isom-Poster4
.
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