Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Thinner and Miniaturization Embedded Device Package, MCeP, for PoP and Module Application
Thinner and Miniaturization Embedded Device Package, MCeP, for PoP and Module Application
Tanaka, Kouichi, Nobuyuki Kurashima, Hajime Iizuka, Kiyoshi Ooi, Yoshihiro Machida, Satoshi Shiraki, and Tetsuya Koyama. 2012. “Thinner and Miniaturization Embedded Device Package, MCeP, for PoP and Module Application.” IMAPSource Proceedings 2012 (1): 1010–17. https://doi.org/10.4071/isom-2012-WP67.