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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Copper Wire Bonding: R&D to High Volume Manufacturing
Bob Chylak
,
Horst Clauberg
,
John Foley
,
Ivy Qin
,
copper
wire bonding
cu wire
osat
idm
fpga
wire diameter
•
https://doi.org/10.4071/isom-2012-WA41
IMAPSource Conference Papers
Chylak, Bob, Horst Clauberg, John Foley, and Ivy Qin. 2012. “Copper Wire Bonding: R&D to High Volume Manufacturing.”
IMAPSource Proceedings
2012 (1): 638–49.
https://doi.org/10.4071/isom-2012-WA41
.
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