Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:24995/feed
Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process

K. Macurova, R. Bermejo, M. Pletz, R. Schöngrundner, T. Antretter, T. Krivec, M. Morianz, M. Brizoux, A. Lecavelier,
Assembly processresidual stresswarpageclassical laminate theoryinterfacial modelFEA
https://doi.org/10.4071/isom-TP63
IMAPSource Conference Papers
Macurova, K., R. Bermejo, M. Pletz, R. Schöngrundner, T. Antretter, T. Krivec, M. Morianz, M. Brizoux, and A. Lecavelier. 2014. “Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process.” IMAPSource Proceedings 2014 (1): 355–60. https:/​/​doi.org/​10.4071/​isom-TP63.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system