Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process
Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process
Macurova, K., R. Bermejo, M. Pletz, R. Schöngrundner, T. Antretter, T. Krivec, M. Morianz, M. Brizoux, and A. Lecavelier. 2014. “Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process.” IMAPSource Proceedings 2014 (1): 355–60. https://doi.org/10.4071/isom-TP63.
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