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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold process
J. H. Kim
,
K. H. Kim
,
Jin Yu
,
black pad
electroless nickel immersion gold (ENIG) process
galvanic corrosion
under bump metallurgy (UBM)
•
https://doi.org/10.4071/isom-2010-TP4-Paper4
IMAPSource Conference Papers
Kim, J. H., K. H. Kim, and Jin Yu. 2010. “A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold Process.”
IMAPSource Proceedings
2010 (1): 306–13.
https://doi.org/10.4071/isom-2010-TP4-Paper4
.
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