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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold process

J. H. Kim, K. H. Kim, Jin Yu,
black padelectroless nickel immersion gold (ENIG) processgalvanic corrosionunder bump metallurgy (UBM)
https://doi.org/10.4071/isom-2010-TP4-Paper4
IMAPSource Conference Papers
Kim, J. H., K. H. Kim, and Jin Yu. 2010. “A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold Process.” IMAPSource Proceedings 2010 (1): 306–13. https:/​/​doi.org/​10.4071/​isom-2010-TP4-Paper4.
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