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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process
Bernd Scholz
,
WeiYang Lim
,
Ferdous Sarwar
,
Syed Sajid Ahmad
,
Aaron Reinholz
,
Microelectronic
Electroplating
Copper
Tin
Tall structures
Heat dissipation
Selective Electrodeposition
Bumps
Pillars
•
https://doi.org/10.4071/isom-2010-THA5-Paper7
IMAPSource Conference Papers
Scholz, Bernd, WeiYang Lim, Ferdous Sarwar, Syed Sajid Ahmad, and Aaron Reinholz. 2010. “Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process.”
IMAPSource Proceedings
2010 (1): 947–53.
https://doi.org/10.4071/isom-2010-THA5-Paper7
.
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