Vol. 2012, Issue 1, 2012January 01, 2012 EDT
A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules
A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules
Knight, Roy W., Seth Fincher, Sushil H. Bhavnani, Daniel K. Harris, and R. Wayne Johnson. 2012. “A Numerical Study of Single Phase Dielectric Fluid Immersion Cooling of Multichip Modules.” IMAPSource Proceedings 2012 (1): 581–90. https://doi.org/10.4071/isom-2012-WA22.