Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance Silicon
Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance Silicon
Tang, Jiajie, and Le Luo. 2011. “Wafer Level Integration of MMIC and Microwave IPD with Metal/BCB Multilayer Interconnection Based on Low Resistance Silicon.” IMAPSource Proceedings 2011 (1): 1067–73. https://doi.org/10.4071/isom-2011-THA6-Paper1.