Vol. 2010, Issue 1, 2010January 01, 2010 EDT
A study of high Cu behavior on electrolytic Ni and electroless Ni pad finish
A study of high Cu behavior on electrolytic Ni and electroless Ni pad finish
Lee, Hyun-Kyu, Yong-Chul Chu, Myung-Ho Chun, and Sang-Ho Jeon. 2010. “A Study of High Cu Behavior on Electrolytic Ni and Electroless Ni Pad Finish.” IMAPSource Proceedings 2010 (1): 806–12. https://doi.org/10.4071/isom-2010-THA2-Paper4.