Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow
Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow
Soman, Varun, Vikram Venkatadri, and Mark D. Poliks. 2019. “Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow.” IMAPSource Proceedings 2019 (1): 428–33. https://doi.org/10.4071/2380-4505-2019.1.000428.
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