Soman, Varun, Vikram Venkatadri, and Mark D. Poliks. 2019. “Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow.” IMAPSource Proceedings 2019 (1): 428–33. https://doi.org/10.4071/2380-4505-2019.1.000428.