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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow

Varun Soman, Vikram Venkatadri, Mark D. Poliks,
Chip on Flex (CoF)Mass ReflowProcess YieldStencil PrintingThroughput
https://doi.org/10.4071/2380-4505-2019.1.000428
IMAPSource Conference Papers
Soman, Varun, Vikram Venkatadri, and Mark D. Poliks. 2019. “Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional Reflow.” IMAPSource Proceedings 2019 (1): 428–33. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000428.
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