Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
O’Reilly, Michael J., Jeff Leal, Suzette K. Pangrle, and Kenneth Vartanian. 2011. “Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications.” IMAPSource Proceedings 2011 (1): 1028–32. https://doi.org/10.4071/isom-2011-THA4-Paper4.
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