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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
SIP with TSV for Class 1 Medical Devices
Doug Link
,
Chip-on-flip-chip
heterogeneous multichip module
system in package
through silicon via (TSV)
•
https://doi.org/10.4071/isom-TP51
IMAPSource Conference Papers
Link, Doug. 2014. “SIP with TSV for Class 1 Medical Devices.”
IMAPSource Proceedings
2014 (1): 313–18.
https://doi.org/10.4071/isom-TP51
.
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