ISSN 2380-4505
Das, Rabindra N., Frank D. Egitto, John M. Lauffer, Tim Antesberger, and Voya R. Markovich. 2011. “Z-Axis Interconnections for Next Generation Packaging.” IMAPSource Proceedings 2011 (1): 469–75. https://doi.org/10.4071/isom-2011-WA1-Paper4.