Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip
Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip
Theuss, H., K. Elian, M. Fink, M. Fries, F.-P. Kalz, B. Schwabe, M. Vaupel, et al. 2011. “Mechanical Stress Impact of Assembly Processes onto a Stress-Sensitive Testchip.” IMAPSource Proceedings 2011 (1): 619–26. https://doi.org/10.4071/isom-2011-WA5-Paper3.
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