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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

Rabindra N. Das, Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, Voya R. Markovich,
Package-Interposer-Package PIP Package-on-Package PoP 3D-Integration ASICs
• https://doi.org/10.4071/isom-2012-WA15
IMAPSource Conference Papers
Das, Rabindra N., Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, and Voya R. Markovich. 2012. “Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration.” IMAPSource Proceedings 2012 (1): 561–67. https://doi.org/10.4071/isom-2012-WA15.
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