Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

Das, Rabindra N., Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, and Voya R. Markovich. 2012. “Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration.” IMAPSource Proceedings 2012 (1): 561–67. https:/​/​doi.org/​10.4071/​isom-2012-WA15.