Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

Rabindra N. Das; Frank D. Egitto; Barry Bonitz; Erich Kopp; Mark D. Poliks; Voya R. Markovich

doi:10.4071/isom-2012-WA15

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Das, Rabindra N., Frank D. Egitto, Barry Bonitz, Erich Kopp, Mark D. Poliks, and Voya R. Markovich. 2012. “Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration.” IMAPSource Proceedings 2012 (1): 561–67. https://doi.org/10.4071/isom-2012-WA15.

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