ISSN 2380-4505
Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property
Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property
Masaya Toba, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, Kazuhiko Kurafuchi,
Toba, Masaya, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, and Kazuhiko Kurafuchi. 2019. “Semi-Additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission Property.” IMAPSource Proceedings 2019 (1): 409–14. https://doi.org/10.4071/2380-4505-2019.1.000409.