Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Cu diffusion into the glass under bias temperature stress condition for through glass vias (TGV) applications
Cu diffusion into the glass under bias temperature stress condition for through glass vias (TGV) applications
Kim, Hoon, Ling Cai, Albert Fahey, Rajesh Vaddi, Bin Zhu, and Prantik Mazumder. 2018. “Cu Diffusion into the Glass under Bias Temperature Stress Condition for through Glass Vias (TGV) Applications.” IMAPSource Proceedings 2018 (1): 259–63. https://doi.org/10.4071/2380-4505-2018.1.000259.
Powered by Scholastica, the modern academic journal management system