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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Use of Wafer Applied Underfill for 3D Stacking
Antonio La Manna
,
K. J. Rebibis
,
C. Gerets
,
E. Beyne
,
wafer applied underfill
3D Integration
multi-die stacking
•
https://doi.org/10.4071/isom-2011-TA1-Paper2
IMAPSource Conference Papers
La Manna, Antonio, K. J. Rebibis, C. Gerets, and E. Beyne. 2011. “Use of Wafer Applied Underfill for 3D Stacking.”
IMAPSource Proceedings
2011 (1): 8–16.
https://doi.org/10.4071/isom-2011-TA1-Paper2
.
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