Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability

Sheila F Chopin, Varughese Mathew,
Cl contamination Polyvinyl chloride (PVC) Polyvinylidene chloride (PVDC) Cellulose
• https://doi.org/10.4071/2380-4505-2019.1.000095
IMAPSource Conference Papers
Chopin, Sheila F, and Varughese Mathew. 2019. “Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability.” IMAPSource Proceedings 2019 (1): 95–99. https://doi.org/10.4071/2380-4505-2019.1.000095.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system