Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability
Sheila F Chopin
,
Varughese Mathew
,
Cl contamination
Polyvinyl chloride (PVC)
Polyvinylidene chloride (PVDC)
Cellulose
•
https://doi.org/10.4071/2380-4505-2019.1.000095
IMAPSource Conference Papers
Chopin, Sheila F, and Varughese Mathew. 2019. “Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability.”
IMAPSource Proceedings
2019 (1): 95–99.
https://doi.org/10.4071/2380-4505-2019.1.000095
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats