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Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Electromigration in Power Devices
Hao Zhuang
,
Robert Bauer
,
Markus Dinkel
,
Electromigration
Thermal migration
power devices
solder joint
•
https://doi.org/10.4071/2380-4505-2020.1.000078
IMAPSource Conference Papers
Zhuang, Hao, Robert Bauer, and Markus Dinkel. 2020. “Electromigration in Power Devices.”
IMAPSource Proceedings
2020 (1): 78–84.
https://doi.org/10.4071/2380-4505-2020.1.000078
.
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