Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Electromigration in Power Devices
Hao Zhuang
,
Robert Bauer
,
Markus Dinkel
,
Electromigration
Thermal migration
power devices
solder joint
•
https://doi.org/10.4071/2380-4505-2020.1.000078
IMAPSource Conference Papers
Zhuang, Hao, Robert Bauer, and Markus Dinkel. 2020. “Electromigration in Power Devices.”
IMAPSource Proceedings
2020 (1): 78–84.
https://doi.org/10.4071/2380-4505-2020.1.000078
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
