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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
HIGH RELIABILITY HIGH MELTING LEAD-FREE MIXED BIAGX SOLDER PASTE SYSTEM
HongWen Zhang
,
Ning-Cheng Lee
,
high temperature
lead-free
solder
solder paste
solder joint
mixed
wetting
voiding
BiAg
•
https://doi.org/10.4071/isom-2012-TA43
IMAPSource Conference Papers
Zhang, HongWen, and Ning-Cheng Lee. 2012. “HIGH RELIABILITY HIGH MELTING LEAD-FREE MIXED BIAGX SOLDER PASTE SYSTEM.”
IMAPSource Proceedings
2012 (1): 119–26.
https://doi.org/10.4071/isom-2012-TA43
.
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