Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure
Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure
Furusawa, Takeshi, Naomi Kawamura, Toshiki Furutani, and Takashi Kariya. 2012. “Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure.” IMAPSource Proceedings 2012 (1): 491–96. https://doi.org/10.4071/isom-2012-TP65.