Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity
Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity
Aguirre, Jerry, Paul Garland, Marcos Vargas, Heather Tallo, and Joseph Tallo. 2011. “Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity.” IMAPSource Proceedings 2011 (1): 905–13. https://doi.org/10.4071/isom-2011-THA1-Paper6.