Demonstration of Inkjet Printed Nanoparticle-based Inks for Solder Bump Replacement

Jacob Sadie; Steven Volkman; Vivek Subramanian

doi:10.4071/isom-2012-TP51

Sadie, Jacob, Steven Volkman, and Vivek Subramanian. 2012. “Demonstration of Inkjet Printed Nanoparticle-Based Inks for Solder Bump Replacement.” IMAPSource Proceedings 2012 (1): 419–24. https://doi.org/10.4071/isom-2012-TP51.

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Demonstration of Inkjet Printed Nanoparticle-based Inks for Solder Bump Replacement

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