Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Demonstration of Inkjet Printed Nanoparticle-based Inks for Solder Bump Replacement
Demonstration of Inkjet Printed Nanoparticle-based Inks for Solder Bump Replacement
Sadie, Jacob, Steven Volkman, and Vivek Subramanian. 2012. “Demonstration of Inkjet Printed Nanoparticle-Based Inks for Solder Bump Replacement.” IMAPSource Proceedings 2012 (1): 419–24. https://doi.org/10.4071/isom-2012-TP51.