Multiphysics Modeling of Underfill Flow and Cure during Thermocompression Bonding

Mark Oliver; Nagi Elabbasi

doi:10.4071/isom-2015-WP65

Loading [Contrib]/a11y/accessibility-menu.js

Oliver, Mark, and Nagi Elabbasi. 2015. “Multiphysics Modeling of Underfill Flow and Cure during Thermocompression Bonding.” IMAPSource Proceedings 2015 (1): 526–29. https://doi.org/10.4071/isom-2015-WP65.

View more stats