ISSN 2380-4505
Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Pre-applied inter chip fill material for 3D chip stack integration – How to improve bonding quality and reliability
Pre-applied inter chip fill material for 3D chip stack integration – How to improve bonding quality and reliability
Takeshita, Kan, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani, Jun-Wei Shen, Tetsuharu Yuge, Hiroya Kodama, and Yasuhiro Kawase. 2016. “Pre-Applied Inter Chip Fill Material for 3D Chip Stack Integration – How to Improve Bonding Quality and Reliability.” IMAPSource Proceedings 2016 (1): 333–37. https://doi.org/10.4071/isom-2016-WP43.